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Fabrication Technology for Through-Wafer Interconnects V.G. Kutchoukov

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For the development of autonomously working systems, low-cost and small-size sensors are required to provide the system with information from the environment. Therefore these sensors are often integrated on-chip. This thesis describes different through-wafer interconnect methods, intended to be applicable to most sensors and actuator devices.

For the development of autonomously working systems, low-cost and small-size sensors are required to provide the system with information from the environment. Therefore these sensors are often integrated on-chip. This thesis describes different through-wafer interconnect methods, intended to be applicable to most sensors and actuator devices.

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